On May 21, 2026, Prof. Sun’s succesful lecture took  place at the FEE CTU in Prague. During the lecture, the speaker discussed the rapid development of artificial intelligence, including generative models such as ChatGPT, and the growing demands these technologies place on computational performance and energy efficiency. He explained how current AI models operate with trillions of parameters and why their computational requirements are outpacing the capabilities of conventional semiconductor scaling. A major part of the talk focused on topics such as the 3Dx3D Super Moore Era, 3Dx3D System Scaling, and the evolution of semiconductor technologies over recent decades. Prof. Sun presented the concept of 3Dx3D system scaling, combining 3D CMOS and 3D heterogeneous integration, and explained how these technologies are shaping the future of AI and next-generation computing architectures. The lecture also addressed current challenges in AI development, including the need for dramatically improved energy efficiency, the importance of sustainability, new approaches to system and algorithm design, and the role of advanced materials in future semiconductor technologies. The event concluded with a lively debate and discussion with the audience, during which participants raised questions about future AI scalability, semiconductor innovation, and the long-term outlook for computing technologies.

All photos are courtesy of Kateřina Hrubá, the PR Coordinator of the Institute of International Studies at the Faculty of Social Sciences, Charles University.

About Prof. Sun: He is a distinguished guest of SCRC during his visit from May 17 to May 24, 2026, who also attended the Czech Investment Forum as part of the CzechInvest’s Czech Semicon Days 2026, for which SCRC served as an expert partner. Prof. Sun is also a renowned expert with more than 40 years of experience in semiconductor research and development. He has served, among other roles, as CTO of TSMC and Head of Research at IBM. He has made significant contributions to the development of CMOS technologies, 3D transistor structures, and the concept of 3Dx3D system scaling. He currently serves as Dean of the Industry-Academia Innovation School and Senior Vice President at National Yang Ming Chiao Tung University.